Datasheet
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1) (2)
RECOMMENDED OPERATING CONDITIONS
TPS5420-Q1
SLVS752B – NOVEMBER 2007 – REVISED JUNE 2008 ...................................................................................................................................................
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T
J
INPUT VOLTAGE OUTPUT VOLTAGE PACKAGE
(2)
PART NUMBER
– 40 ° C to 125 ° C 5.5 V to 36 V Adjustable to 1.22 V SOIC (D) TPS5420QDRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VIN – 0.3 V to 40 V
(3)
BOOT – 0.3 V to 50 V
PH (steady-state) – 0.6 V to 40 V
(3)
V
I
Input voltage range EN – 0.3 V to 7 V
VSENSE – 0.3 V to 3 V
BOOT-PH 10 V
PH (transient < 10 ns) – 1.2 V
I
O
Source current PH Internally limited
I
lkg
Leakage current PH 10 µ A
T
J
Operating virtual-junction temperature range – 40 ° C to 150 ° C
T
stg
Storage temperature range – 65 ° C to 150 ° C
Human-Body Model (HBM) 2000 V
ESD Electrostatic discharge rating
Machine Model (MM) 150 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Approaching the absolute maximum rating for the VIN pin may cause the voltage on the PH pin to exceed the absolute maximum rating.
THERMAL IMPEDANCE
PACKAGE
JUNCTION-TO-AMBIENT
8-pin D
(3)
75 ° C/W
(1) Maximum power dissipation may be limited by overcurrent protection.
(2) Power rating at a specific ambient temperature T
A
should be determined with a junction temperature of 125 ° C. This is the point where
distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125 ° C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more
information.
(3) Test board conditions:
a. 3 in × 3 in, two layers, thickness: 0.062 inch
b. 2-oz. copper traces located on the top and bottom of the PCB
MIN MAX UNIT
V
I
Input voltage range, VIN 5.5 36 V
T
J
Operating junction temperature – 40 125 ° C
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Product Folder Link(s): TPS5420-Q1