Datasheet
TPS54110
SLVS500C – DECEMBER 2003–REVISED FEBRUARY 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGED DEVICES
T
J
OUTPUT VOLTAGE
PLASTIC HTSSOP (PWP)
(1)
–40°C to 125°C Adjustable to 0.891 V TPS54110PWP
(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54110PWPR). See application
section of data sheet for PowerPAD drawing and layout information.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
VALUE UNIT
VIN, SS/ENA, SYNC –0.3 to 7 V
RT –0.3 to 6 V
Input voltage range, V
I
VSENSE –0.3 to 4 V
BOOT –0.3 to 17 V
VBIAS, PWRGD, COMP –0.3 to 7 V
Output voltage range, V
O
PH –0.6 to 10 V
PH Internally Limited
Source current, I
O
COMP, VBIAS 6 mA
PH 3.5 A
Sink current COMP 6 mA
SS/ENA,PWRGD 10 mA
Voltage differential AGND to PGND ±0.3 V
Continuous power dissipation See Thermal Information Table
Operating virtual junction temperature range, T
J
–40 to 150 °C
Storage temperature, T
stg
–65 to 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Input voltage range, V
I
3 6 V
Operating junction temperature, T
J
–40 125 °C
THERMAL INFORMATION
TPS54110
THERMAL METRIC
(1)
PWP UNITS
20 PINS
θ
JA
Junction-to-ambient thermal resistance 34.0
θ
JCtop
Junction-to-case (top) thermal resistance 21.2
θ
JB
Junction-to-board thermal resistance 6.7
°C/W
ψ
JT
Junction-to-top characterization parameter 0.3
ψ
JB
Junction-to-board characterization parameter 6.5
θ
JCbot
Junction-to-case (bottom) thermal resistance 1.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): TPS54110