Datasheet

2
Thermal
Pad (9)
COMP
36
1
4
7
8
5
EN
GND
PH
VSENSE
VIN
BOOT
RT/CLK
See appended
Mechanical
Data for
size and shape
TPS54061
SLVSBB7C –MAY 2012–REVISED JANUARY 2014 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. ORDERING INFORMATION
(1)
T
J
PACKAGE PART NUMBER
–40°C to 150°C VSON-8 DRB TPS54061DRB
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
PIN CONFIGURATION
VSON-8 PACKAGE
(BOTTOM VIEW)
PIN FUNCTIONS
PIN
DESCRIPTION
NAME NUMBER
A bootstrap capacitor is required between BOOT and PH. If the voltage on this capacitor is below the minimum
BOOT 1
required by the output device, the output is forced to switch off until the capacitor is refreshed.
VIN 2 Input supply voltage, 4.7 V to 60 V.
Enable pin with internal pull-up current source. Pull below 1.18 V to disable. Float to enable. Adjust the input
EN 3
undervoltage lockout with two resistors, see the Enable and Adjusting Undervoltage Lockout section.
Resistor Timing and External Clock. An internal amplifier holds this pin at a fixed voltage when using an
external resistor to ground to set the switching frequency. If the pin is pulled above the PLL upper threshold, a
RT/CLK 4 mode change occurs and the pin becomes a synchronization input. The internal amplifier is disabled and the
pin is a high impedance clock input to the internal PLL. If clocking edges stop, the internal amplifier is re-
enabled and the mode returns to a resistor frequency programming.
VSENSE 5 Inverting input of the transconductance (gm) error amplifier.
Error amplifier output and input to the output switch current comparator. Connect frequency compensation
COMP 6
components to this pin.
GND 7 Ground
PH 8 The source of the internal high-side power MOSFET and drain of the internal low-side MOSFET
Thermal Pad 9 GND pin must be electrically connected to the exposed pad on the printed circuit board for proper operation.
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