Datasheet

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Connect Pin 1 to Analog Ground Plane
in This Area for Optimum Performance
Minimum Recommended Top
Side Analog Ground Area
0.3478
0.0150
0.06
0.0256
0.1700
0.1340
0.0630
0.0400
Ø0.01804 PL
0.2090
Ø0.0130
8 PL
Minimum Recommended Exposed
Copper Area for PowerPAD. 5mm
Stencils May Require 10 Percent
Larger Area
0.0650
0.0500
0.0500
0.0650
0.0339
0.0339
0.0500
Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside
PowerPAD Area 4 x 0.018 Diameter Under Device as Shown.
Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground
Area Is Extended.
0.3820
TPS54010
SLVS509B – MAY 2004 – REVISED JUNE 2005
tain as much separation as possible while keeping ted to the largest area available. Additional areas on
the layout compact. Connect the bias capacitor from the top or bottom layers also help dissipate heat, and
the VBIAS pin to analog ground using the isolated any area available must be used when 6-A or greater
analog ground trace. If a slow-start capacitor or RT operation is desired. Connection from the exposed
resistor is used, or if the SYNC pin is used to select area of the PowerPAD to the analog ground plane
350-kHz operating frequency, connect them to this layer must be made using 0.013-inch diameter vias to
trace. avoid solder wicking through the vias.
For operation at full rated load current, the analog Eight vias must be in the PowerPAD area with four
ground plane must provide an adequate additional vias located under the device package. The
heat-dissipating area. A 3-inch by 3-inch plane of size of the vias under the package, but not in the
1-ounce copper is recommended, though not manda- exposed thermal pad area, can be increased to
tory, depending on ambient temperature and airflow. 0.018. Additional vias beyond the twelve rec-
Most applications have larger areas of internal ground ommended that enhance thermal performance must
plane available, and the PowerPAD must be connec- be included in areas not under the device package.
Figure 11. Recommended Land Pattern for 28-Pin PWP PowerPAD
9