Datasheet

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ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
DISSIPATION RATINGS
(1) (2)
TPS54010
SLVS509B – MAY 2004 – REVISED JUNE 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
T
A
OUTPUT VOLTAGE PACKAGE PART NUMBER
-40°C to 85°C Adjustible down to 0.9 V Plastic HTSSOP (PWP)
(1)
TPS54010PWP
(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54010PWPR). See the application
section of the data sheet for PowerPAD drawing and layout information.
over operating free-air temperature range (unless otherwise noted)
(1)
TPS54010 UNIT
SS/ENA, SYNC –0.3 to 7
RT –0.3 to 6
V
I
Input voltage range VSENSE –0.3 to 4 V
PVIN, VIN –0.3 to 4.5
BOOT –0.3 to 10
VBIAS, COMP, PWRGD –0.3 to 7
V
O
Output voltage range V
PH –0.6 to 6
PH Internally limited
V
O
Source current
COMP, VBIAS 6 mA
PH 25 A
I
S
Sink current COMP 6 mA
SS/ENA, PWRGD 10
Voltage differential AGND to PGND ±0.3 V
T
J
Operating junction temperature range –40 to 125 °C
T
stg
Storage temperature range –65 to 150 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C
Human body model (HBM) 1.5 kV
Electrostatic Discharge (ESD) ratings
CDM 750 V
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
MIN NOM MAX UNIT
V
I
Input voltage, VIN 3 4 V
Power Input voltage, PVIN 2.2 4 V
T
J
Operating junction temperature –40 125 °C
THERMAL IMPEDANCE T
A
= 25°C T
A
= 70°C T
A
= 85°C
PACKAGE
JUNCTION-TO-AMBIENT POWER RATING POWER RATING POWER RATING
28-Pin PWP with solder 14.4°C/W 6.94 W
(3)
3.81 W 2.77 W
28-Pin PWP without solder 27.9°C/W 3.58 W 1.97 W 1.43 W
(1) For more information on the PWP package, refer to TI technical brief, literature number SLMA002.
(2) Test board conditions:
a. 3 inch x 3 inch, 4 layers, thickness: 0.062 inch
b. 1.5-oz. copper traces located on the top of the PCB
c. 1.5-oz. copper ground plane on the bottom of the PCB
d. 0.5-oz. copper ground planes on the 2 internal layers
e. 12 thermal vias (see Recommended Land Pattern in applications section of this data sheet)
(3) Maximum power dissipation may be limited by over current protection.
2