Datasheet
TPS51216
SLUSAB9A –NOVEMBER 2010–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
ORDERABLE DEVICE OUTPUT MINIMUM
T
A
PACKAGE PINS
NUMBER SUPPLY QUANTITY
TPS51216RUKR Tape and reel 3000
–40°C to 85°C Plastic Quad Flat Pack (20 pin QFN) 20
TPS51216RUKT Mini reel 250
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
MIN MAX
VBST –0.3 36
VBST
(3)
–0.3 6
SW –5 30
Input voltage range
(2)
VLDOIN, VDDQSNS, REFIN –0.3 3.6 V
VTTSNS –0.3 3.6
PGND, VTTGND –0.3 0.3
V5IN, S3, S5, TRIP, MODE –0.3 6
DRVH –5 36
DRVH
(3)
–0.3 6
DRVH
(3)
(duty cycle < 1%) –2.5 6
VTTREF, VREF –0.3 3.6
Output voltage range
(2)
V
VTT –0.3 3.6
DRVL –0.3 6
DRVL (duty cycle < 1%) –2.5 6
PGOOD –0.3 6
Junction temperature range, T
J
125 °C
Storage temperature range, T
STG
–55 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.
(3) Voltage values are with respect to the SW terminal.
THERMAL INFORMATION
TPS51216
THERMAL METRIC UNITS
QFN (20) PINS
θ
JA
Junction-to-ambient thermal resistance 94.1
θ
JCtop
Junction-to-case (top) thermal resistance 58.1
θ
JB
Junction-to-board thermal resistance 64.3
°C/W
ψ
JT
Junction-to-top characterization parameter 31.8
ψ
JB
Junction-to-board characterization parameter 58.0
θ
JCbot
Junction-to-case (bottom) thermal resistance 5.9
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