Datasheet

TPS51206
SLUSAH1A –MAY 2011–REVISED OCTOBER 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)(2)
ORDERABLE
T
A
PACKAGE PINS OUTPUT SUPPLY QUANTITY
DEVICE NUMBER
TPS51206DSQR 3000
–40°C to 85°C Plastic SON 10 Tape and Reel
TPS51206DSQT 250
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the TI
website at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE
UNIT
MIN MAX
VDD, S3, S5 –0.3 7 V
Input voltage range
(2)
VLDOIN, VTTSNS, VDDQSNS –0.3 3.6
PGND –0.3 0.3 V
Output voltage range
(2)
VTT, VTTREF –0.3 3.6
HBM QSS 009-105 (JESD22-A114A) 2 kV
Electrostatic discharge
CDM QSS 009-147 (JESD22-C101B.01) 500 V
Junction temperature, T
J
125 ˚C
Operating free-air temperature, T
A
–55 150 ˚C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.
RECOMMENDED OPERATING CONDITIONS
MIN TYP MAX UNIT
Supply voltage VDD 3.1 6.5 V
Input voltage range
(1)
S3, S5 –0.1 6.5 V
VLDOIN, VTTSNS, VDDQSNS –0.1 3.5
PGND –0.1 0.1
Output voltage VTT, VTTREF –0.1 3.5 V
range
(1)
Operating free-air temperature, T
A
–40 85 °C
(1) All voltage values are with respect to the network ground terminal unless otherwise noted.
THERMAL INFORMATION
TPS51206
THERMAL METRIC
(1)
DSQ UNITS
10 PINS
θ
JA
Junction-to-ambient thermal resistance 70.3
θ
JCtop
Junction-to-case (top) thermal resistance 46.3
θ
JB
Junction-to-board thermal resistance 33.8
°C/W
ψ
JT
Junction-to-top characterization parameter 2.9
ψ
JB
Junction-to-board characterization parameter 33.5
θ
JCbot
Junction-to-case (bottom) thermal resistance 16.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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