Datasheet

www.ti.com
6 List of Materials
List of Materials
Table 2. List of Materials
QT REFERNCE DESCRIPTION SIZE MRF PART NUMBER
Y DESIGNATOR
3 C1, C5, C6 Capacitor, ceramic, 10 µF, 6.3 V, X5R, 10% 805 TDK C2012X5R0J106K
2 C2, C3 Capacitor, ceramic, 10 µF, 6.3 V, X5R, 10% 1210 TDK C3225X7R1C106M
1 C4 Capacitor, ceramic, 4.7 µF, 6.3-V, X5R, 10% 805 TDK C2012X5R0J475K
0 C7, C8, C9 Capacitor, ceramic, X5R, 6.3V 805
1 C10 Capacitor, ceramic, 0.1 µF, 50 V, X7R, 10% 805 TDK C2012X7R1H104K
J1, J2, J3, J4, Keystone
8 Header, single pin 0.125 × 1 1573-2
J5, J6, J7, J8 Electronics
1 JP1 Header, 3-pin, 100 mil spacing 0.1 × 0.3 Sullins PTC36SAAN
0 R1 Resistor, chip, 1/10W, 1% 805
1 R2 Resistor, chip, 0 Ohms, 1/10-W, 1% 805 Std Std
2 SW1, SW2 Switch, O N-ON Mini Toggle 0.28 × 0.18 NKK G12AP
IC, High Performance DDRI&II 3A LDO & Buffered
1U1 HTTSOP-10 TI TPS51100DGQ
Reference
1 PCB, 2-layer FR4, 3.0" x 3.0" 0.063thk 2.25 × 3.20 Any HPA078A
1 Shunt, 100 mil jumper 0.1 × 0.2 Sullins PJ-19-2-0
4 Bumpon, Transparent 0.44 × 0.2 3M SJ5303
Using the TPS511008 SLUU201–JULY 2004