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Board Layout www.ti.com
3 Board Layout
Figure 14, Figure 15, and Figure 16 show the board layout for the TPS4334xEVM printed-circuit board
(PCB).
The TPS4334x converter offers high efficiency, but does dissipate power. The PowerPAD™ package
offers an exposed thermal pad to enhance thermal performance. This must be soldered to the copper
landing on the PCB for optimal performance. The PCB provides 2-oz copper planes on the top and bottom
to dissipate heat.
Figure 14. Top Assembly Layer
8
TPS4334xEVM Evaluation Module SLVU463–July 2011
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