Datasheet

V
OUT
(ac coupled )
100mV/div
I
L
1A/div
SW
10V/div
Time – 1µs/div
V
OUT
(ac coupled )
100mV/div
I
L
1A/div
SW
10V/div
Time – 500µs/div
V
OUT
(ac coupled )
100mV/div
I
L
1A/div
SW
10V/div
Time – 1µs/div
Time - 5 ms/div
EN
5V/div
VCC
5V/div
Vout
5V/div
PGood
5V/div
V
IN
5V/div
V
OUT
5V/div
PGOOD
5V/div
VCC
5V/div
Time – 5ms/div
Time - 200 s/divm
Vout (ac coupled)
200mV/div
VCC
5V/div
Iout
1A/div
TPS43060
TPS43061
www.ti.com SLVSBP4C –DECEMBER 2012–REVISED SEPTEMBER 2013
THERMAL CONSIDERATIONS
The TPS43060 and TPS43061 junction temperature should not exceed 150°C under normal operating
conditions. This restriction limits the power dissipation of the device. Power dissipation of the controller includes
gate drive power loss and bias power loss of the internal VCC regulator. The TPS43060 and TPS43061 are
packaged in a thermally enhanced WQFN package which includes a PowerPAD™ that improves the thermal
capabilities. The thermal resistance of the WQFN package depends on the PCB layout and the PowerPAD
connection. As mentioned in the layout considerations, the PowerPAD must be soldered to the analog ground on
the PCB with thermal vias underneath the PowerPAD to achieve good thermal performance.
For best thermal performance pcb copper area should be sized to improve thermal capabilities of the
components in the power path dissipating the most power. This includes the sense resistors, inductor, low-side
FET and high-side FET. Manufacturer guidelines for the selected external FETs should be followed.
CHARACTERISTICS OF THE TPS43061 BOOST CONVERTER EXAMPLE
Figure 22. Load Transient Figure 23. Start-up with VIN
Figure 24. Start-up with EN Figure 25. Output Ripple in CCM
Figure 26. Output Ripple in DCM Figure 27. Output Ripple in Pulse-Skipping Mode
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Product Folder Links: TPS43060 TPS43061