Datasheet

TPS40210-Q1, TPS40211-Q1
SLVS861D –AUGUST 2008–REVISED APRIL 2010 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
ORDERABLE TOP-SIDE
T
J
V
FB
(TYP) PACKAGE
(2)
PART NUMBER MARKING
700 mV MSOP PowerPAD™ – DGQ Reel of 2500 TPS40210QDGQRQ1 4210Q
–40°C to 125°C
260 mV MSOP PowerPAD™ – DGQ Reel of 2500 TPS40211QDGQRQ1 4211Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DEVICE RATINGS
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
VDD –0.3 V to 52 V
Input voltage range RC, SS, FB, DIS/EN –0.3 V to 10 V
ISNS –0.3 V to 8 V
Output voltage range COMP, BP, GDRV –0.3 V to 9 V
T
J
Operating junction temperature range –40°C to 150°C
T
stg
Storage temperature range –55°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
V
VDD
Input voltage 4.5 52 V
T
J
Operating junction temperature –40 125 °C
PACKAGE DISSIPATION RATINGS
AIRFLOW R
qJA
HIGH-K BOARD
(1)
POWER RATING (W) POWER RATING (W)
PACKAGE
(LFM) (°C/W) T
A
= 25°C T
A
= 85°C
10-Pin MSOP PowerPAD
0 (Natural Convection) 57.7 1.73 0.693
(DGQ)
(1) Ratings based on JEDEC high thermal conductivity (High K) board. For more information on the test method, see TI technical brief
SZZA017.
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
TYP UNIT
Human-Body Model (HBM) 1500
V
Charged-Device Model (CDM) 1500
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Product Folder Link(s): TPS40210-Q1 TPS40211-Q1