Datasheet
TPS40210, TPS40211
SLUS772E –MARCH 2008– REVISED OCTOBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PACKAGE TAPE AND REEL
T
J
PACKAGE PART NUMBER
LEAD QUANTITY
2500 TPS40210DGQR
10-Pin MSOP
DGQ
PowerPAD
80 TPS40210DGQ
-40°C to 125°C
3000 TPS40210DRCR
10-Pin SON DRC
250 TPS40210DRCT
2500 TPS40211DGQR
10-Pin MSOP
DGQ
PowerPAD
80 TPS40211DGQ
-40°C to 125°C
3000 TPS40211DRCR
10-Pin SON DRC
250 TPS40211DRCT
DEVICE RATINGS
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TPS40210
UNIT
TPS40211
VDD –0.3 to 52
Input voltage range RC, SS, FB, DIS/EN –0.3 to 10
V
ISNS –0.3 to 8
Output voltage range COMP, BP, GDRV –0.3 to 9
T
J
Operating junction temperature range –40 to 150
°C
T
stg
Storage temperature –55 to 150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
VDD
Input voltage 4.5 52 V
T
J
Operating Junction temperature -40 125 °C
PACKAGE DISSIPATION RATINGS
R
θJA
High-K Board
(1)
Power Rating (W) Power Rating (W)
PACKAGE AIRFLOW (LFM)
(°C/W) T
A
= 25°C T
A
= 85°C
10-Pin MSOP PowerPAD 0 (Natural Convection) 57.7 1.73 0.693
(DGQ)
10-Pin SON (DRC) 0 (Natural Convection) 47.9 2.08 0.835
(1) Ratings based on JEDEC High Thermal Conductivity (High K) Board. For more information on the test method, see TI Technical Brief
SZZA017.
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
MIN TYP MAX UNIT
Human Body Model (HBM) 1500
V
Charged Device Model (CDM) 1500
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Product Folder Link(s): TPS40210 TPS40211