Datasheet

ISNS
GDRV
VDD
SS
RC
COMP
FB
GND
1
2
3
4
8
7
6
5
DPACKAGE
(TOP VIEW)
COMP
FB
SS
ISNS
RC
Soft-Start
and
Overcurrent
E/A andSS
Reference
EnableE/A
700mV
PWM
Logic
GDRVvoltage
swinglimited
to(V – 8V)
IN
VDD
GDRV
GND
+
–
+
Driver
OSC
UVLO
5
3
4
2
7
1
8
6
TPS40200-EP
SGLS371A –JANUARY 2007–REVISED JANUARY 2013 www.ti.com
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP UNIT
θ
JC
Thermal resistance, junction to case
(1)
49 °C/W
θ
JA
Thermal resistance, junction to ambient
(1)
HIGH-K 97.5 °C/W
θ
JA
Thermal resistance, junction to ambient
(1)
LOW-K 176 °C/W
(1) TI uses test boards designed to JESD 51-3 and JESD 51-7 for thermal-impedance measurements. The parameters outlined in these
standards also are used to set up thermal models.
Table 1. ORDERING INFORMATION
OUTPUT
T
A
PACKAGE ORDERABLE PART NUMBER MEDIUM QUANTITY
VOLTAGE
–55°C to 125°C Adjustable SOIC – D TPS40200MDREP Tape and reel 2500/reel
DEVICE INFORMATION
Figure 3. Functional Block Diagram
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