Datasheet

1
10
100
1000
10000
100000
1000000
110 130 150 170 190 210 230
Continous T
J
(°C)
Estimated Life (Hours)
Electromigration Fail Mode
TPS40200-HT
SGLS400C –OCTOBER 2009–REVISED DECEMBER 2012 www.ti.com
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PACKAGE PARAMETER MIN TYP MAX UNIT
D θ
JC
Junction-to-case thermal resistance 49 °C/W
Junction-to-case thermal resistance (to bottom of case) 5.7
HKJ or HKQ θ
JC
°C/W
Junction-to-case thermal resistance (to top of case lid - as if formed dead bug) 13.7
Figure 3. TPS40200SKGD1 Operating Life Derating Chart
Notes:
1. See datasheet for absolute maximum and minimum recommended operating conditions.
2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package
interconnect life).
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