Datasheet

TPS40200-HT
www.ti.com SGLS400C –OCTOBER 2009–REVISED DECEMBER 2012
Table 1. Bond Pad Coordinates in Microns
DISCRIPTION PAD NUMBER X min Y min X max Y max
RC 1 63.27 1124.01 164.07 1224.81
SS 2 61.20 922.77 162.00 1023.57
COMP 3 61.20 250.38 162.00 351.18
FB 4 70.20 74.16 171.00 174.96
GND 5 1193.94 91.44 1294.74 192.24
GDRV 6 1188.90 245.34 1289.70 346.14
ISNS 7 1189.80 978.30 1290.60 1079.10
VDD 8 1137.60 1148.49 1238.40 1249.29
Table 2. Test Pad Coordinates in Microns
DISCRIPTION PAD NUMBER X min Y min X max Y max
NC 1 189.00 27.18 256.50 94.68
NC 2 292.86 27.18 360.36 94.68
NC 3 396.72 27.18 464.22 94.68
NC 4 517.77 27.18 585.27 94.68
NC 5 757.71 27.27 825.21 94.77
Table 3. ORDERING INFORMATION
(1)
T
A
PACKAGE ORDERABLE PART NUMBER
–55°C to 175°C D TPS40200HD
KGD TPS40200SKGD1
–55°C to 210°C HKJ TPS40200SHKJ
HKQ TPS40200SHKQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
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