Datasheet

0.0
0.0
½ ½
1350 mm
½
½
1350 mm
|
52 mm
|
52 mm
TPS40200HTA0
1
2
3
4
8
7
6
5
VDD
ISNS
GDRV
GND
RC
SS
COMP
FB
TPS40200
R
SENSE
V
IN
V
OUT
R1 R2
L1
C2
D1
C1
C3
C4
C5
C6
R4
R3
R5
Q1
50
60
70
80
90
100
0 0.5 1 1.5 2 2.5 3
LoadCurrent- A
Efficiency-%
V =8V
V =12V
V =16V
IN
IN
IN
V =5V
OUT
TPS40200-HT
SGLS400C –OCTOBER 2009–REVISED DECEMBER 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TYPICAL APPLICATION
Figure 1. 12-V to 5-V Buck Converter Figure 2. Typical Efficiency of Application Circuit 1
(Described in Application 1)
With 94% Efficiency
BARE DIE INFORMATION
(1)(2)
BACKSIDE BOND PAD BOND PAD
DIE THICKNESS BACKSIDE FINISH
POTENTIAL METALLIZATION COMPOSITION THICKNESS
15 mils. Silicon with backgrind GND Cu/Ni/Pd 15 µm
(1) Bond pad over active circuitry
(2) Bond recommendation: Use Au or Cu wire bond
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Product Folder Links: TPS40200-HT