Datasheet

TPS40200
SLUS659F –FEBRUARY 2006–REVISED MARCH 2012 www.ti.com
Table 4. List of Materials, Buck Regulator, 12 V to 3.3 V and 5.0 V
Ref. Des. Value Description Size Mfr. Part Number
C1 100 μF Capacitor, Aluminum, SM, 25-V, 0.3 Ω 8 x 10 mm Sanyo 20SVP100M
C12 220 μF Capacitor, Aluminum, SM, 6.3-V, 0.4 Ω 8 x 6.2 mm Panasonic EEVFC0J221P
C13 100 pF Capacitor, Ceramic, 50V, [COG], [20%] 603 muRata Std.
C3 0.1 pF Capacitor, Ceramic, 50V, [X7R], [20%] 603 muRata Std.
C2, C11 1 μF Capacitor, Ceramic, 50V, [X7R], [20%] 603 muRata Std.
C4, C5 470 pF Capacitor, Ceramic, 50V, [X7R], [20%] 603 muRata Std.
C6 0.047 μF Capacitor, Ceramic, 50V, [X7R], [20%] 603 muRata Std.
C7 10 pF Capacitor, Ceramic, 50V, [COG], [20%] 603 muRata Std.
C8 1500 pF Capacitor, Ceramic, 50V, [X7R], [20%] 603 muRata Std.
D1 12 V Diode, Zener, 12-V, 350-mW SOT23 Diodes, Inc. BZX84C12T
D2 Diode, Schottky, 30-A, 30-V SMC On Semi MBRS330T3
D3 12 V Diode Zener 12-V 5 mA VMD2 Rohm VDZT2R12B
J1,J3 Terminal Block 4-Pin 15-A 5.1-mm 0.8 x 0.35 OST ED2227
J2 Header, 2-pin, 100-mil spacing, (36-pin strip) 0.100 x 2 Sullins PTC36SAAN
L1 33 μH Inductor, SMT, 3.2 A, .039 Ω 12.5 x 12.5 mm TDK SLF12575T330M3R2PF
PCB 2 Layer PCB 2 Ounce Cu 1.4 x 2.12 x HPA164
0.062
Q1 Trans, N-Chan Enhancement Switching, 50 mA SOT-143B Phillips BSS83
Q2 MOSFET, P-ch, 30-V, 3.6-A, 75-mΩ SuperSOT-6 Fairchild FDC654P
U1 IC, Low Cost Non-Sync Buck Controller SO-8 TI TPS40200D
R1 10 Ω Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R10 100 kΩ Resistor, Chip, , 1/16W, 1% 603 Std. Std.
R11 10 kΩ Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R12 1 MΩ Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R13 49.9 Ω Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R2 0.02 Ω Resistor, Chip, ½ W, 5% 2010 Std. Std.
R3 68.1 kΩ Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R4 2.0 kΩ Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R5 0 Ω Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R6 26.7 kΩ Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R7 1.0 kΩ Resistor, Chip, 1/16 W, 1% 603 Std. Std.
R8 300 kΩ Resistor, Chip, 1/16 W, 1% 603 Std. Std.
PC Board Plots
The following figures Figure 41 through Figure 43 show the design of the TPS40200EVM-001 printed circuit
board The design uses 2-layer, 2oz copper and is 1.4” x 2.3” in size All components are mounted on the top side
to allow the user to easily view, probe, and evaluate the TPS40200 control IC in a practical application. Moving
components to both sides of the printed circuit board (PCB) or using additional internal layers can offer additional
size reduction for space constrained applications
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