Datasheet

TPS40200
www.ti.com SLUS659F –FEBRUARY 2006–REVISED MARCH 2012
ELECTRICAL CHARACTERISTICS (continued)
–40°C < T
A
= T
J
< 85°C, V
DD
= 12 V, f
OSC
= 100 kHz (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SOFT START
Internal soft-start pull-up 65 105 170
R
SS(chg)
resistance
kΩ
Internal soft-start pull-down 190 305 485
R
SS(dchg)
resistance
V
SSRST
Soft-start reset threshold 100 150 200 mV
OVERCURRENT PROTECTION
0°C < T
A
< 125°C 65 100 140
V
ILIM
Overcurrent threshold 4.5 < V
VDD
< 52 mV
–40°C < T
A
< 125°C 55 100 140
OC
DF
Overcurrent duty cycle
(1)
2 %
V
ILIM(rst)
Overcurrent reset threshold 100 150 200 mV
OSCILLATOR
Oscillator frequency range
(1)
35 500
f
OSC
R
RC
= 200 kΩ, C
RC
= 470 pF 85 100 115 kHz
Oscillator frequency
R
RC
= 68.1 kΩ, C
RC
= 470 pF 255 300 345
12 V < V
VDD
< 52 V -9 0
Frequency line regulation %
4.5 V < V
VDD
< 12 V –20 0
V
RMP
Ramp amplitude 4.5 V < V
VDD
< 52 V V
VDD
÷10 V
PULSE WIDTH MODULATOR
V
VDD
= 12 V 200 400
Minimum controllable pulse
t
MIN
ns
width
(2)
V
VDD
= 30 V 100 200
f
osc
= 100 kHz, C
L
= 470 pF 93 95
D
MAX
Maximum duty cycle %
f
osc
= 300 kHz, C
L
= 470 pF 90 93
K
PWM
Modulator and power stage dc 8 10 12
V/V
gain
ERROR AMPLIFIER
I
IB
Input bias current 100 250 nA
AOL Open loop gain
(1)
60 80 dB
GBWP Unity gain bandwidth
(1)
1.5 3 MHz
I
COMP(src)
Output source current V
FB
= 0.6 V, COMP = 1 V 100 250 μA
I
COMP(snk)
Output sink current V
FB
= 1.2 V, COMP = 1 V 1.0 2.5 mA
(1) Ensured by design. Not production tested.
(2) See Figure 21 for for t
MIN
vs f
OSC
at various input voltages.
THERMAL CHARACTERISTICS
(1)
over operating free-air temperature range (unless otherwise noted)
PACKAGE PARAMETER MIN TYP MAX UNIT
SOIC (D) θ
JC
Thermal resistance, junction-to-case 49
θ
JC
Thermal resistance, junction-to-case 85
θ
JB
Thermal resistance, junction-to-board 21 °C/W
QFN (DRB)
θ
JP
Thermal resistance, junction-to-pad 8
θ
JA
Thermal resistance, junction-to-ambient (natural convection) 67
(1) TI uses test boards designed to JESD 51-3 and JESD 51-7 for thermal-impedance measurements. The parameters outlined in these
standards also are used to set up thermal models. TI uses the thermal-model program ThermCAL, a finite-difference thermal-modeling
tool. Using this test procedure, the junction-to-case thermal resistance of this part is 49°C/W. For more information see TI Technical
Brief SZZA017.
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