Datasheet

PACKAGE DISSIPATION RATINGS
TPS40077
www.ti.com ..................................................................................................................................................... SLUS714D – JANUARY 2007 – REVISED APRIL 2009
Thermal Impedance, T
A
= 25 ° C Power Rating T
A
= 85 ° C Power Rating
Junction-to-Ambient
(1)
Natural convection 37 ° C/W 2.7 W 1.08 W
150 LFM airflow 30 ° C/W 3.33 W 1.33 W
250 LFM airflow 28 ° C/W 3.57 W 1.42 W
500 LFM airflow 26 ° C/W 3.84 W 1.52 W
(1) For more information on the board and the methods used to determine ratings, see the PowerPAD Thermally Enhanced Package
application report (SLMA002 ).
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