Datasheet
THERMAL
PAD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
KFF
RT
BP5
SYNC
SGND
SS/SD
VFB
COMP
ILIM
VIN
HDRV
BPN10
SW
BP10
LDRV
PGND
PWP PACKAGE
(1)(2)
(TOP VIEW)
TPS40060
TPS40061
SLUS543F –DECEMBER 2002–REVISED JUNE 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
T
A
LOAD CURRENT PACKAGE
(1)
PART NUMBER
SOURCE
(2)
Plastic HTSSOP (PWP) TPS40060PWP
–40°C to 85°C
SOURCE/SIN
(2)
Plastic HTSSOP (PWP) TPS40061PWP
(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS40060PWPR). See the Application
Information of the data sheet for PowerPAD drawing and layout information.
(2) See Application Information section.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TPS40060
TPS40061
VIN 60 V
VFB, SS/SD, SYNC –0.3 V to 6 V
V
IN
Input voltage range
–0.3 V to 60 V or VIN+5 V
SW
(whichever is less)
SW. transient < 50 ns –2.5 V
V
OUT
Output voltage range COMP, RT, KFF, SS –0.3 V to 6 V
I
IN
Input current KFF 5 mA
I
OUT
Output current RT 200 µA
T
J
Operating junction temperature range –40°C to 125°C
T
stg
Storage temperature –55°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
IN
Input voltage 10 55 V
T
A
Operating free-air temperature –40 85 °C
(1) For more information on the PWP package, refer to TI Technical Brief (SLMA002).
(2) PowerPAD™ heat slug must be connected to SGND (Pin 5), or electrically isolated from all other pins.
2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated
Product Folder Links: TPS40060 TPS40061