Datasheet

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SLVS612 − APRIL 2006
2
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
PACKAGE PART NUMBER
−40°C to 85°C Plastic HTSSOP(PWP)
(1)
TPS40056PWP
(1)
The PWP package is also available taped and reeled. Add an R suffix to the device type
(i.e., TPS40056PWPR). See the application section of the data sheet for PowerPAD
drawing and layout information.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(2)
TPS40056 UNIT
VIN 45
Input voltage range, V
IN
VFB, SS, SYNC, EA_REF −0.3 to 6
Input voltage range, V
IN
SW −0.3 to 45
V
SW, transient < 50 ns −2.5
V
Output voltage range, V
O
COMP, RT, SS −0.3 to 6
Output current, I
OUT
RT 200 µA
Operating junction temperature range, T
J
−40 to 125
Storage temperature, T
stg
−55 to 150
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260
C
(2)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Input voltage, V
I
10 40 V
Operating free-air temperature, T
A
−40 85 °C
THERMAL
PAD
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SYNC
RT
BP5
EA_REF
SGND
SS/SD
VFB
COMP
ILIM
VIN
BOOST
HDRV
SW
BP10
LDRV
PGND
PWP PACKAGE
(3)(4)
(TOP VIEW)
(3)
For more information on the PWP package, refer to TI Technical Brief, Literature No. SLMA002.
(4)
PowerPADt heat slug must be connected to SGND (pin 5) or electrically isolated from all other pins.