Datasheet

TPS40054
TPS40055
TPS40057
SLUS593H –DECEMBER 2003–REVISED JULY 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
PACKAGE APPLICATION OUTPUT SUPPLY MINIMUM QUANTITY DEVICE NUMBER
Tube 90 TPS40054PWP
Source
Tape and Reel 2000 TPS40054PWPR
Tube 90 TPS40055PWP
Plastic HTSSOP
–40°C to 85°C Source/Sink
(PWP)
Tape and Reel 2000 TPS40055PWPR
Tube 90 TPS40057PWP
Source/Sink with
prebias
Tape and Reel 2000 TPS40057PWPR
DEVICE RATINGS
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TPS40054
TPS40055 UNIT
TPS40057
VFB, SS/SD, SYNC –0.3 to 6
VIN, SW –0.3 to 45
V
IN
Input voltage range SW, transient < 50 ns –2.5
SW, transient < 50 ns, V
VIN
< 14 V –5.0
KFF, with I
IN(max)
= – 5 mA –0.3 to 11
COMP, RT, SS/SD –0.3 to 6
Output voltage
V
O
range
KFF 5 mA
I
O
Output current RT 200 µA
T
J
Maximum junction temperature
(2)
150
T
J
Operating junction temperature range –40 to 125 °C
T
stg
Storage temperature –55 to 150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Device may shut down at junction temperatures below 150°C
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
IN
Input voltage 8 40 V
T
A
Operating free-air temperature –40 85 °C
THERMAL INFORMATION
THERMAL METRIC
(1)
PWP (20 PINS) UNITS
θ
JA
Junction-to-ambient thermal resistance 38.3
θ
JCtop
Junction-to-case (top) thermal resistance 28.0
θ
JB
Junction-to-board thermal resistance 9.0
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 8.9
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): TPS40054 TPS40055 TPS40057