Datasheet

TPS40055
TPS40055-EP
SGLS310D –JULY 2005–REVISED FEBRUARY 2012 www.ti.com
SIMPLIFIED APPLICATION DIAGRAM
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
T
A
APPLICATION
(2)
PACKAGE
(3)(4)
PART NUMBER
–55°C to 125°C SOURCE/SINK Plastic HTSSOP (PWP) TPS40055MPWPREP
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) See Application Information section.
(3) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(4) The PWP package is also available taped and reeled. Add an R suffix to the device type. See the application section of the data sheet
for PowerPAD drawing and layout information.
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Product Folder Link(s): TPS40055-EP