Datasheet
TPS386596L33
SLVSA75 –JULY 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web
site at www.ti.com.
Custom threshold voltages from 0.80V to 4.6V, 4.8V to 6.0V are available through the use of factory EEPROM programming. Minimum
order quantities apply. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
TPS386596 UNIT
Input voltage range, VCC –0.3 to 7.0 V
Other voltage ranges: V
MR
, V
SENSE1
, V
SENSE2
, V
SENSE3
, V
SENSE4
, V
RESET
–0.3 to 7.0 V
RESETpin current 5 mA
ESD rating, HBM 2 kV
ESD rating, CDM 500 V
Continuous total power dissipation See Thermal Information
Table
Operating virtual junction temperature range, T
J
–40 to 150 °C
Operating ambient temperature range, T
A
–40 to 125 °C
Storage temperature range, T
stg
–65 to 150 °C
(1) Stresses beyond those listed under Absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) As a result of the low dissipated power in this device, it is assumed that T
J
= T
A
THERMAL INFORMATION
TPS386596
THERMAL METRIC
(1)
UNITS
DGK (8 PINS)
q
JA
Junction-to-ambient thermal resistance 183.8
q
JCtop
Junction-to-case (top) thermal resistance 70.7
q
JB
Junction-to-board thermal resistance 72.8
°C/W
y
JT
Junction-to-top characterization parameter 4.9
y
JB
Junction-to-board characterization parameter 68.4
q
JCbot
Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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