Datasheet

TPS3831
TPS3839
SBVS193B –JUNE 2012–REVISED APRIL 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION
(1)
PACKAGE
PRODUCT THRESHOLD VOLTAGE (V) PACKAGE-LEAD DESIGNATOR
TPS3831A09 0.900 X2SON-4 DQN
TPS3831G12 1.100 X2SON-4 DQN
TPS3831E16 1.520 X2SON-4 DQN
TPS3831G18 1.670 X2SON-4 DQN
TPS3831L30 2.630 X2SON-4 DQN
TPS3831K33 2.930 X2SON-4 DQN
TPS3831G33 3.080 X2SON-4 DQN
TPS3831K50 4.380 X2SON-4 DQN
SOT23-3 DBZ
TPS3839A09 0.900
X2SON-4 DQN
SOT23-3 DBZ
TPS3839G12 1.100
X2SON-4 DQN
SOT23-3 DBZ
TPS3839E16 1.520
X2SON-4 DQN
SOT23-3 DBZ
TPS3839G18 1.670
X2SON-4 DQN
SOT23-3 DBZ
TPS3839L30 2.630
X2SON-4 DQN
SOT23-3 DBZ
TPS3839K33 2.930
X2SON-4 DQN
SOT23-3 DBZ
TPS3839G33 3.080
X2SON-4 DQN
SOT23-3 DBZ
TPS3839K50 4.380
X2SON-4 DQN
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
MIN MAX UNIT
VDD –0.3 7 V
Voltage
On RESET –0.3 7 V
Current RESET pin 10 mA
Operating ambient, T
A
–40 +85 °C
Temperature
(2)
Storage, T
stg
–65 +150 °C
Human body model (HBM) 2 kV
Electrostatic discharge (ESD) rating:
Charge device model (CDM) 500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) As a result of the low dissipated power in this device, it is assumed that the junction temperature is equal to the ambient temperature.
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