Datasheet

VDD

GND

/RESET

0.9 V-6.5 V

/MR

GND

0.1 µF

JP1

RST

PWPD

GND

VDD

TPS3831G33DQN

Schematic

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5 Schematic

Figure 4. TPS3831G33EVM-187 Schematic

6 Bill of Material

Table 1. TPS3831G33EVM-187 Bill of Material

Count RefDes Value Description Size Part Number MFR

1 C1 0.1 µF Capacitor, ceramic chip, 10 V, X5R, ±10% 0402 STD STD

3 J1–J3 PEC02SAAN Header, male 2-pin, 100-mil spacing, 0.100 in × 2 PEC02SAAN Sullins

1 JP1 PEC02SAAN Header, male 2-pin, 100-mil spacing, 0.100 in × 2 PEC02SAAN Sullins

1 U1 TPS3831G33DQN TPS3831G33 IC, ultra-low power, supply voltage SON TPS3831G33DQN TI

supervisor

1 — PCB PCB, 1.30 in × 1.645 in × 0.062 in 1.30 in × 1.645 in × 0.062 in PWR187 Any

1 JP1 Shunt, black 100-mil 929950-00 3M

Notes: 1. These assemblies are ESD sensitive, observe ESD precautions.

2. These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.

3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.

4. Ref designators marked with an asterisk ('**') cannot be substituted.

All other components can be substituted with equivalent MFG's components.

TPS3831G33EVM-187 Evaluation Module SLVU774–September 2012

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