Datasheet
Schematic and Bill of Materials
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5 Schematic and Bill of Materials
This section provides the TPS3808G01EVM bill of materials and schematic.
5.1 Parts List
Table 3 lists the bill of materials for the TPS3808G01EVM.
Table 3. TPS3808G01EVM Bill of Materials
(1)(2)(3)(4)
Count RefDes Value Description Size Part Number MFR
1 C1 0.1 µF Capacitor, ceramic, low inductance, 10 V, X7R, 0603 STD STD
10%
1 C2 22 nF Capacitor, ceramic, low inductance, 10 V, X7R, 0603 STD STD
10%
1 C3 1 nF Capacitor, ceramic, 10 V, X7R, 10% 0805 STD STD
6 J1, J2, J3, J4, PEC02SAAN Header, male 2-pin, 100-mil spacing TH PEC02SAAN Sullins
J5, J6
1 JP1 PEC04DAAN Header, male 2x4-pin, 100-mil spacing TH PEC04DAAN Sullins
3 JP2, JP3, JP4 PEC02SAAN Header, male 2-pin, 100-mil spacing TH PEC02SAAN Sullins
1 JP5 PEC03SAAN Header, male 3-pin, 100-mil spacing TH PEC03SAAN Sullins
1 R1 10 kΩ Resistor, chip, 1/16W, 1% 0603 STD STD
1 R2 113 kΩ Resistor, chip, 1/16W, 1% 0603 STD STD
1 R3 63.4 kΩ Resistor, chip, 1/16W, 1% 0603 STD STD
1 R4 100 kΩ Resistor, chip, 1/16W, 1% 0603 STD STD
1 R5 30.9 kΩ Resistor, chip, 1/16W, 1% 0603 STD STD
1 R6 19.1 kΩ Resistor, chip, 1/16W, 1% 0603 STD STD
1 R7 200 kΩ Resistor, chip, 1/16W, 1% 0603 STD STD
1 U1 TPS3808G01DBV Low quiescent current, programmable-delay SOT23-6 TPS3808G01DBV TI
supervisory circuit
1 N/A PCB, FR-4, 2-Layer, SMOBC, 1.700" x 2.00" x HPA537** Any
.062"
5 N/A Shunt, Open-top 151-8000 Kobiconn
(1)
These assemblies are ESD sensitive. ESD precautions shall be observed.
(2)
These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.
(3)
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
(4)
Ref designators marked with an asterisk (**) cannot be substituted. All other components can be substituted with equivalent
manufacturing components.
5.2 Schematic
The schematic for this EVM is appended to this document.
8
TPS3808G01EVM SBVU015–April 2010
Copyright © 2010, Texas Instruments Incorporated