Datasheet

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
    
SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPS370xY chip information
These chips, when properly assembled, display characteristics similar to those of the TPS370x. Thermal
compression or ultrasonic bonding may be caused on the doped-aluminum bonding pads. The chips may be
mounted with conductive epoxy or a gold-silicon preform.
TPS3705Y
TPS3707Y
(1)
(2)
(3)
(8)
(6)
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%
ALL DIMENSIONS ARE IN MILS
46
50
(4)
(7)
(5)
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
MR 1 I Manual reset
VDD 2 Supply voltage
GND 3 Ground
PFI 4 I Power-fail comparator input
PFO 5 O Power-fail comparator output
WDI TPS3705
6
I Watchdog timer input
NC TPS3707
6
No internal connection
RESET 7 O Active-low reset output
WDO TPS3705
8
O Watchdog timer output
RESET TPS3707
8
O Active-high reset output