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TPS3307Y Chip Information
56
48
TPS3307Y
(1)
(2)
(3)
(5)
(6)
CHIP THICKNESS: 10 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS
(4)
(7)
(8)
TPS3307-18 , TPS3307-25 , TPS3307-33
SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006
These chips, when properly assembled, display characteristics similar to those of the TPS3307. Thermal
compression or ultrasonic bonding may take place on the doped aluminium bonding pads. The chips may be
mounted with conductive epoxy or a gold-silicon preform.
Table 2. Terminal Functions
TERMINAL
I/O DESCRIPTION
NAME NO.
GND 4 Ground
MR 7 I Manual reset
RESET 5 O Active-low reset output
RESET 6 O Active-high reset output
SENSE1 1 I Sense voltage input 1
SENSE2 2 I Sense voltage input 2
SENSE3 3 I Sense voltage input 3
V
DD
8 Supply voltage
4
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