Datasheet

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SLVS367A − MARCH 2001 − REVISED JUNE 2001
6
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DISSIPATION RATING TABLE
PACKAGE T
A
≤ 25°C DERATING FACTOR T
A
= 70°C T
A
= 85°C
14-pin PWP with solder
‡
2668 26.68 mW/°C 1467 1067
14-pin PWP without solder
‡
1024 10.24 mW/°C 563 409
16-pin PWP with solder
‡
2739 27.39 mW/°C 1506 1095
16-pin PWP without solder
‡
1108 11.08 mW/°C 609 443
JUNCTION-CASE THERMAL RESISTANCE TABLE
14-pin PWP
Junction-case thermal resistance 2.07 °C/W
16-pin PWP Junction-case thermal resistance 2.07 °C/W
‡
Test Board Conditions:
1. Thickness: 0.062I
2. 3I × 3I (for packages < 27 mm long)
3. 4I × 4I (for packages > 27 mm long)
4. 2-oz copper traces located on the top of the board (0,071 mm thick)
5. Copper areas located on the top and bottom of the PCB for soldering
6. Power and ground planes, 1-oz copper (0,036 mm thick)
7. Thermal vias, 0,33 mm diameter, 1,5 mm pitch
8. Thermal isolation of power plane
For more information, refer to TI technical brief literature number SLMA002.
recommended operating conditions
MIN NOM MAX UNIT
Supply voltage, V
CC
10 15 V
Input voltage, V
I
BOOT to PGND 10 29 V
electrical characteristics over recommended operating virtual junction temperature range,
V
CC
= 12 V, ENABLE = High, C
L
= 3.3 nF (unless otherwise noted)
supply current
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
CC
Quiescent current
V
(ENABLE)
= Low, V
CC
= 13 V 425 µA
I
CC
Quiescent current
V
(ENABLE)
= High, V
CC
= 13 V 1 mA
NOTE 2: Ensured by design, not production tested.