Datasheet

     
   
SLVS160C – FEBRUARY 1997 – REVISED OCTOBER 2002
3
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TPS28xxY chip information
This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be
mounted with conductive epoxy or a gold-silicon preform.
39
39
TPS2816Y
(4)
(2)
(3)
(5)
(1)
OUT
GND
IN
V
CC
V
DD
†
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
(4)
(2)
(3)
(1)
(5)
†
TPS2816 through TPS2819 only
Terminal Functions
TPS2816, TPS2818, TPS2828 (inverting driver)
TERMINAL
DESCRIPTION
NAME NO.
DESCRIPTION
V
DD
1 Regulator supply voltage input. (Not connected on TPS2828)
GND 2 Ground
IN 3 Driver input.
OUT 4 Driver output, OUT = IN
V
CC
5 Driver supply voltage/regulator output voltage
TPS2817, TPS2819, TPS2829 (noninverting driver)
TERMINAL
DESCRIPTION
NAME NO.
DESCRIPTION
V
DD
1 Regulator supply voltage input. (Not connected on TPS2829)
GND 2 Ground
IN 3 Driver input.
OUT 4 Driver output, OUT= IN
V
CC
5 Driver supply voltage/regulator output voltage