Datasheet

TPS27082L
www.ti.com SLVSBR5B –DECEMBER 2012–REVISED SEPTEMBER 2013
Improving Package Thermal Performance
The package θJA value under standard conditions on a High-K board is available in the Dissipation Rating Table.
θ
JA
value depends upon the PC board layout. An external heat sink and/or a cooling mechanism like a cold air
fan can help reduce θ
JA
and thus improving device thermal capability. Refer to TI’s design support web page at
www.ti.com/thermal for a general guidance on improving device thermal performance.
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