Datasheet
TPS27082L
SLVSBR5B –DECEMBER 2012–REVISED SEPTEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)(3)
Specified at T
J
= –40°C to 125°C (unless otherwise noted)
VALUE UNIT
MIN MAX
VIN
max
,
VIN, VOUT pin maximum voltage with respect to
–0.1 8 V
GND pin
VOUT
max
V
ON/OFF
ON/OFF control voltage –0.3 8 V
Max continuous drain current of Q1 3
I
Q1-ON
A
Max pulsed drain current of Q1
(4)
9.5
P
D
Max power dissipation at T
A
= 25°C, T
J
= 150°C
(4)
6 Pin-TSOT, θ
JA
=105°C/W 1190 mW
ESD Rating – HBM 2000 V
All pins
ESD Rating – CDM 500 V
T
A
Operating free-air ambient temperature range -40 125
(5)
°C
T
J-max
Operating virtual junction temperature 150 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
(2) Operating at the absolute T
J-max
of 150°C can affect reliability – for higher reliability it is recommended to ensure T
J
< 125°C
(3) Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance.
(4) Pulse Width < 300µs, Duty Cycle < 2%
(5) T
J-max
limits and other related conditions apply. Refer to SOA charts, Figure 8 through Figure 13
DISSIPATION RATINGS
(1)(2)(3)
DERATING FACTOR
BOARD PACKAGE θ
JC
θ
JA
(4)
T
A
< 25°C T
A
= 70°C T
A
= 85°C T
A
= 105°C
ABOVE T
A
= 25°C
High-K 6-Pin TSOT
43°C/W 105°C/W 1190 mW 760 mW 619 mW 428 mW 9.55 mW/°C
(JEDEC 51-7) (DDC)
(1) Maximum dissipation values for retaining a maximum allowable device junction temperature of 150°C
(2) Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance
(3) Package thermal data based on a 76x114x1.6mm, 4-layer board with 2-oz Copper on outer layers
(4) Operating at the absolute T
J-max
of 150°C can affect reliability; T
J
≤ 125°C is recommended
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