Datasheet

( )
J(MAX) A
(MAX)
JA
T T
PD
-
=
q
TPS27081A
www.ti.com SLVSBE9D –APRIL 2012–REVISED APRIL 2013
Thermal Reliability
For higher reliability it is recommended to limit TPS27081A IC’s die junction temperature to less than 105°C. The
IC junction temperature is directly proportional to the on-chip power dissipation. Use the following equation to
calculate maximum on-chip power dissipation to achieve the maximum die junction temperature target:
Where:
T
J(MAX)
is the target maximum junction temperature.
T
A
is the operating ambient temperature.
R
θJA
is the package junction to ambient thermal resistance. (4)
Improving Package Thermal Performance
The package θ
JA
value under standard conditions on a High-K board is listed in the DISSIPATION RATINGS. θ
JA
value depends on the PC board layout. An external heat sink and/or a cooling mechanism, like a cold air fan, can
help reduce θ
JA
and thus improve device thermal capabilities. Refer to TI’s design support web page at
www.ti.com/thermal for a general guidance on improving device thermal performance.
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