Datasheet

TPS2560
TPS2561
SLVS930A – DECEMBER 2009– REVISED FEBRUARY 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS AND ORDERING INFORMATION
MARKING RECOMMENDED MAXIMUM
AMBIENT SON
(3)
DEVICE
(1)
ENABLE
CONTINUOUS LOAD CURRENT PER
TEMPERATURE
(2)
(DRC)
CHANNEL
TPS2560 Active low TPS2560DRC 2560
–40°C to 85°C 2.5 A
TPS2561 Active high TPS2561DRC 2561
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Maximum ambient temperature is a function of device junction temperature and system level considerations, such as power dissipation
and board layout. See dissipation rating table and recommended operating conditions for specific information related to these devices.
(3) Add an R suffix to the device type for tape and reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1) (2)
VALUE UNIT
Voltage range on IN, OUTx, ENx or ENx, ILIM, FAULTx –0.3 to 7 V
Voltage range from IN to OUTx –7 to 7 V
Continuous output current Internally Limited
Continuous total power dissipation See the Dissipation Rating Table
Continuous FAULTx sink current 25 mA
ILIM source current Internally Limited mA
HBM 2 kV
ESD
CDM 500 V
ESD – system level (contact/air)
(3)
8/15 kV
T
J
Maximum junction temperature –40 to OTSD2
(4)
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltages are referenced to GND unless otherwise noted.
(3) Surges per EN61000-4-2, 1999 applied between USB and output ground of the TPS2560EVM (HPA424) evaluation module
(documentation available on the Web.) These were the test level, no the failure threshold.
(4) Ambient over temperature shutdown threshold
DISSIPATION RATING TABLE
THERMAL THERMAL T
A
≤ 25°C
RESISTANCE
(1)
RESISTANCE
BOARD PACKAGE POWER
θ
JA
θ
JC
RATING
High-K
(2)
DRC 41.6 °C/W 10.7 °C/W 2403 mW
(1) Mounting per the PowerPAD
TM
Thermally Enhanced Package application report (SLMA002)
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
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