Datasheet

TPS2556
TPS2557
SLVS931A – NOVEMBER 2009–REVISED FEBRUARY 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS AND ORDERING INFORMATION
AMBIENT SON
(3)
MARKING RECOMMENDED MAXIMUM
DEVICE
(1)
ENABLE
TEMPERATURE
(2)
(DRB) CONTINUOUS LOAD CURRENT
TPS2556 Active low TPS2556DRB 2556
–40°C to 85°C 5.0 A
TPS2557 Active high TPS2557DRB 2557
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Maximum ambient temperature is a function of device junction temperature and system level considerations, such as power dissipation
and board layout. See dissipation rating table and recommended operating conditions for specific information related to these devices.
(3) Add an R suffix to the device type for tape and reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1) (2)
VALUE UNIT
Voltage range on IN, OUT, EN or EN, ILIM, FAULT –0.3 to 7 V
Voltage range from IN to OUT –7 to 7 V
I Continuous output current Internally Limited
See the Dissipation Rating
Continuous total power dissipation
Table
Continuous FAULT sink current 25 mA
ILIM source current Internally Limited mA
HBM 2 kV
ESD
CDM 500 V
ESD – system level (contact/air)
(3)
8/15 kV
T
J
Maximum junction temperature –40 to OTSD2
(4)
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltages are referenced to GND unless otherwise noted.
(3) Surges per EN61000-4-2, 1999 applied between USB and output ground of the TPS2556EVM (HPA423) evaluation module
(documentation available on the Web.) These were the test levels, not the failure threshold.
(4) Ambient over temperature shutdown threshold
DISSIPATION RATING TABLE
THERMAL THERMAL T
A
≤ 25°C
RESISTANCE
(1
RESISTANCE
POWER RATING
BOARD PACKAGE
)
θ
JC
θ
JA
High-K
(2)
DRB 41.6 °C/W 10.7 °C/W 2403 mW
(1) Mounting per the PowerPAD
TM
Thermally Enhanced Package application report (SLMA002).
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
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