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EVM Assembly Drawings and Layout Guidelines

4.2 Layout Guidelines

• TPS2543 placement: Place the TPS2543 near the USB output connector and 150-µF OUT pin filter

capacitor. Connect the exposed pad to the GND pin and the system ground plane using an array of

vias.

• IN pin bypass capacitance: Place the 0.1-µF bypass capacitor near the IN pin and make the

connection using a low-inductance trace.

• DP-OUT/DM-OUT, DP-IN/DM-IN traces: Route these traces as controlled-impedance differential pairs

per the USB-2.0 specification. Minimize the use of vias in the high-speed data lines. Figure 7 provides

a good signal-routing example for the high-speed data traces. In this example, the data pairs are

routed as edge-coupled microstrips with nominal differential impedance of 90 Ω. The reference plane is

tied to GND and is shown in Figure 6. Ensure that the reference plane is void of cuts or splits above

the differential pairs to prevent impedance discontinuities.

SLVU660A–February 2012–Revised February 2013 TPS2543EVM User's Guide

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