Datasheet
TPS2511
SLUSB18 –JUNE 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
ORDERABLE
TRANSPORT MINIMUM TOP-SIDE
T
A
PACKAGE PINS DEVICE
MEDIA QUANTITY MARKING
NUMBER
Tube 80 TPS2511DGN 2511
–40°C to 85°C MSOP (DGN) 8
Tape and Reel 2500 TPS2511DGNR 2511
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Over recommended junction temperature range, voltages are referenced to GND (unless otherwise noted)
MIN MAX UNIT
Supply voltage range IN –0.3 7
Input voltage range EN, ILIM_SET –0.3 7
Voltage range OUT, CS –0.3 7
V
IN to OUT –7 7
DP output voltage, DM output voltage –0.3 IN+0.3 or 5.7
DP input voltage, DM input voltage –0.3 IN+0.3 or 5.7
Continuous output sink current DP input current, DM input current 35
Continuous output source DP output current, DM output current 35
current
mA
Continuous output sink current CS 10
Continuous output source ILIM_SET Internally limited
current
IN, OUT, EN, ILIM_SET, CS 2
Human Body Model (HBM) kV
ESD rating DP, DM 7.5
Charging Device Model (CDM) 500 V
Operating junction temperature, T
J
Internally limited
Storage temperature range, T
stg
–65 150 °C
THERMAL INFORMATION
TPS2511
THERMAL METRIC
(1)
UNITS
DGN (8 PINS)
θ
JA
Junction-to-ambient thermal resistance 65.2
θ
JCtop
Junction-to-case (top) thermal resistance 53.3
θ
JB
Junction-to-board thermal resistance 36.9
°C/W
ψ
JT
Junction-to-top characterization parameter 3.9
ψ
JB
Junction-to-board characterization parameter 36.6
θ
JCbot
Junction-to-case (bottom) thermal resistance 13.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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