Datasheet

TPS2500, TPS2501
SLVS886C –OCTOBER 2008–REVISED AUGUST 2010 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
Eco-mode™
DEVICE TEMPERATURE
(2)
PACKAGE MARKING
Control Scheme
TPS2500 Enabled CHO
–40°C to 85°C DRC (SON)
TPS2501 Disabled OBA
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Maximum ambient temperature is a function of device junction temperature and system-level considerations, such as power dissipation
and board layout. See Dissipation Ratings and Recommended Operating Conditions for specific information related to these devices.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
Input voltage range on SW
(2)
, AUX, IN, USB, ENUSB, EN, FAULT, ILIM –0.3 to 7 V
FAULT sink current 25 mA
ILIM source current 1 mA
T
J
Junction temperature range –40 to 150 °C
ESD – HBM 2 kV
ESD – CDM 500 V
ESD – system level (contact/air)
(3)
8/15 kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Leading edge voltage spikes on SW during normal switching operation may exceed 7 V and are within the intended operation of the
device as long as the maximum voltage does not exceed 10 V for 25 ns. It is important to follow the recommended layout guidelines to
minimize voltage overshoot. Do not force an external voltage source directly on SW.
(3) Surges per EN61000-4-2, 1999 applied between USB and output ground of the TPS2500EVM (HPA337) evaluation module
(documentation available on the Web). These were the test levels, not the failure threshold.
DISSIPATION RATINGS
(1)
THERMAL RESISTANCE
(2)
THERMAL RESISTANCE T
A
≤ 25°C
PACKAGE
q
JA
q
JC
POWER RATING
DRC 41.6°C/W 10.7°C/W 2403 mW
(1) The JEDEC high-K (2s2p) board used to derive this data was a 3-inch × 3-inch (7.62-mm × 7.62-mm), multilayer board with 1-ounce
(0.035-mm) internal power and ground planes and 2-ounce (0.071-mm) copper traces on the top and bottom of the board.
(2) Mounting per the PowerPAD™ Thermally Enhanced Package application report (SLMA002).
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
IN
Supply voltage at IN 1.8 5.25 V
V
START
Supply voltage at IN for start-up 2.2 V
Enable voltage at EN, ENUSB 0 5.25 V
T
J
Operating junction temperature range –40 125 °C
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