Datasheet
TPS24710, TPS24711
TPS24712, TPS24713
SLVSAL2E –JANUARY 2011–REVISED NOVEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE INFORMATION
T
A
PACKAGE PART NUMBER
(1)
FUNCTION FLT, PG POLARITY MARKING
TPS24710 Latched 24710
Active Low
TPS24711 Retry 24711
–40ºC to 85ºC MSOP-10
TPS24712 Latched 24712
Active High
TPS24713 Retry 24713
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range, all voltages referred to GND (unless otherwise noted)
VALUE UNIT
EN, FLT
(1)(2)
, FLTb
(1)(3)
, GATE, OUT, PG
(1)(2)
, PGb
(1)(3)
, SENSE, VCC –0.3 to 30
PROG
(1)
–0.3 to 0.3
Input voltage range V
SENSE to VCC –0.3 to 0.3
TIMER –0.3 to 5
Sink current FLT, PG, FLTb, PGb 5
mA
Source current PROG Internally limited
All pins except PG and PGb 2
Human-body model
ESD rating PG, PGb 0.5 kV
Charged-device model 0.5
Temperature Maximum junction, T
J
Internally limited °C
(1) Do not apply voltages directly to these pins.
(2) for TPS24712/13
(3) for TPS24710/11
THERMAL INFORMATION
TPS24710/11/12/13
THERMAL METRIC
(1)
UNIT
MSOP (10) PINS
θ
JA
Junction-to-ambient thermal resistance 166.5 °C/W
θ
JCtop
Junction-to-case (top) thermal resistance 41.8 °C/W
θ
JB
Junction-to-board thermal resistance 86.1 °C/W
ψ
JT
Junction-to-top characterization parameter 1.5 °C/W
ψ
JB
Junction-to-board characterization parameter 84.7 °C/W
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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