Datasheet

9 List of Materials
www.ti.com List of Materials
Table 10. TPS2459EVM List of Materials
(1) (2) (3) (4) (5) (6) (7) (8) (9)
COUNT REF DES DESCRIPTION PART NUMBER MFR
3 C1, C2, C3 Capacitor, ceramic, 25V, X7R, 20%, 0.1 uF, 0805 Std. Std.
1 C11 Capacitor, aluminum, SM, 10V, 20%, 150 uF, Case D EEV-FK1A151P Panasonic
2 C4, C5 Capacitor, ceramic, 25V, X7R, 20%, 1 uF, 0805 Std. Std.
C51, C55, C56, Capacitor, ceramic, 25V, X7R, 20%, 0.1uF, 0603 Std. Std.
6
C58, C60, C61
2 C52, C53 Capacitor, ceramic, 50V, C0G, 10%, 22pF, 0603 Std. Std.
1 C54 Capacitor, ceramic, 100V, C0G, 5%, 1000pF, 0805 Std. Std.
1 C57 Capacitor, tantalum, 16V, 20%, 1uF, 3216 293D105X0016A2T Vishay
2 C59, C62 Capacitor, tantalum, 10V, 20%, 10uF, 3216 293D106X0010A2T Vishay
1 C6 Capacitor, aluminum, SM, 25V, 20%, 47 uF, Case D EEV-FK1E470P Panasonic
C7, C8, C9, Capacitor, aluminum, SM, 25V, 20%, 220 uF, Case F EEV-FK1E221P Panasonic
4
C10
D1 Diode, TVS, V(RWM) = 13.6 V, 600 W Pk., SMB P6SMB16A "ON Semior
1
Vishayor Littelfuse"
1 D2 Diode, Zener, 4.3 V, 500 mW max., SOD-123 BZT52C4V3 Diodes
1 D3 Diode, Schottky, 1A, 20V, SMA B120 Diodes
D4, D5 Diode, LED, red/green, 1210, 45/35 mcd @ 20 mA, LTST-C155KGJRKT Lite-On
2
0.126 x 0.106in.
1 D51 Diode, LED, green, 20 mA, 30 mcd, SMD SSF-LXH305GD-TR Lumex
1 D52 Diode, Schottky, 1A, 30V, SMA MBRA130 IR
1 D53 Diode, Zener, 7.5V, 3W, SMB 1SMB5922BT3 On Semi
D54, D55, D56, Diode, TVS, low cap., V(RM) = 5 V, 300 W Pk., SOT-23 GL05T Vishay
8 D57, D58, D59,
D60, D61
J1, J2, J3, J4, Jack, banana, non-ins., PC mount, TH 3267 Pomona
6
J5, J6
J17, J18 Header, PCB mnt., vert., 2 x 7, 100 mil spacing, 0.100 2514-6002UB 3M
2
in. x 2 x 7
0 J52 Header, 2 x 5-pin, 100-mil spacing, 0.100 in. x 2 x 5 PEC36DAAN Sullins
J53 Connector, recpt, USB-B, mini, 5-pins, SMT, 0.354in. x UX60-MB-5S8 Hirose
1
0.303in.
1 J54 Header, 2 x 3-pin, 100-mil spacing, 0.100 in. x 2 x 3 PEC36DAAN Sullins
(1)
These assemblies are ESD sensitive, ESD precautions shall be observed.
(2)
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
(3)
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
(4)
"TH" package designation indicates "thru-hole" (leaded ) component.
(5)
Part number information is for reference only to further illustrate component characteristics; substitution of other mfgrs' part of
equal or better specification is permissible. Substitution NOT allowed on part numbers marked with double asterisk (**).
(6)
Double pound sign ('##') after part number indicates preferred device. Acceptable substitutes are listed afterwards, in
decreasing order of preference.
(7)
If banana jacks (J1 - J6) are supplied with solder lugs, dispose of lugs prior to installation on PCB. Solder lugs are NOT to be
installed on assembly.
(8)
Spacers to be installed at each of the thru-holes at the four corners of the PCB assembly, using nylon screws.
(9)
Shunts installed in accordance with manufacturing test procedure during test.
SLUU349 – March 2009 TPS2459 Full-Featured AdvancedMC™ Slot Controller Evaluation Module 23
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