Datasheet

7 EVM Feature Details
7.1 Test Points
EVM Feature Details www.ti.com
The TPS2459EVM contains numerous test points throughout the circuit for monitoring waveforms and
voltage measurement. Table 6 lists the module test points and the signal available at each one. The EVM
PCB layout connects all ground nodes and supply returns to a common GND node, via several power
plane areas. However, due to potentially high loading conditions on the Payload Power output
(SLOT_PWR), multiple ground test points are provided to mitigate the measurement impact of return
current drops. Therefore, where appropriate, certain test points are paired in the table with the pertinent
reference point for meter return connections.
Table 6. Module Test Points
TEST
REF POINT SIGNAL DESCRIPTION
POINT
TP1 12VIN Input 12-V supply
TP3
TP2 3V3IN Input 3.3-V supply
SLOT_PW AdvancedMC™ slot Payload Power, 12-V output
TP4
R
TP6
TP5 SLOT_MP AdvancedMC™ slot Management Power, 3.3 V output
TP7 EN3 Active-high enable input to TPS2459 for the 3.3-V output rail
TP8 TP14 or TP15 EN12 Active-high enable input to TPS2459 for the 12-V output rail
TP9 OREN Active high enable of the 12-V (POWER) supply OR’ing function
TP10 TP11 AdvancedMC™ slot 12-V load current sense voltage
TP12 PASS TPS2459 12-V pass FET gate drive output
TP14
TP13 BLK TPS4359 12-V block/OR’ing FET gate drive output
TP16 FLT12 TPS2459 active-low payload power (12 V) fault output
TP17 PG12 TPS2459 active-low payload power (12 V) powergood signal
TP14
TP18 FLT3 TPS2459 active-low mgmt power (3.3 V) fault output
TP19 PG3 TPS2459 active-low mgmt power (3.3 V) powergood signal
14 TPS2459 Full-Featured AdvancedMC™ Slot Controller Evaluation Module SLUU349 – March 2009
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