Datasheet

TPS2421-1
TPS2421-2
SLUS907G –JANUARY 2009–REVISED MAY 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PRODUCT INFORMATION
(1)
DEVICE FEATURE PACKAGE MARKING
TPS2421-1 Latchoff 2421-1
DDA (SO8 PowerPad™)
TPS2421-2 Auto-retry 2421-2
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE UNIT
Input voltage range, V
VIN
, V
VOUT
–0.3 to 25
V
Voltage range, FLT, PG –0.3 to 20
Maximum continuous output current, I
MAX
9 A
Output sink current, FLT, PG 10 mA
Input voltage range, EN –0.3 to 6
V
Voltage range, CT,
(3)
ISET
(3)
-0.3 to 3
ESD rating, HBM 2.5 kV
ESD rating, CDM 400 V
Operating junction temperature range, T
J
Internally Limited
°C
Storage temperature range, T
stg
–65 to 150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) Do not apply voltage to these pins.
DISSIPATION RATINGS
(1)
PACKAGE θ
JA
θ
JA
θ
JA
LOW K, °C/W HIGH K, °C/W BEST
(2)
, °C/W
DDA 190
(3)
45
(4)
45
(1) Tested per JEDEC JESD51, natural convection. The definitions of high-k and low-k are per JESD 51-7 and JESD 51-3.
(2) The best case thermal resistance is obtained using the recommendations per SLMA002A (2 signal – 2 plane with the pad connected to
the plane).
(3) Low-k (2 signal – no plane, 3 in. by 3 in. board, 0.062 in. thick, 1 oz. copper) test board with the pad soldered, and an additional 0.12
in.2 of top-side copper added to the pad.
(4) High-k is a (2 signal – 2 plane) test board with the pad soldered.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
VIN
, V
VOUT
Input voltage range 3 20
EN Voltage range 0 5 V
FLT, PG Voltage range 0 20
I
OUT
Continuous output current 0 6 A
FLT, PG Output sink current 0 1 mA
C
CT
0.1 nF
R
RSET
49.9 200 kΩ
T
J
Junction temperature –40 125 °C
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