Datasheet
1
2
3
4
5
6
7
14
13
12
11
10
9
8
RTN
FLT
UV
OV
FLTTIM
RAMP
SOURCE
PG
GAT
SENSE
NC
NC
TSSOP-14 PACKAGE
(TOP VIEW)
NC
NC
TPS2394
SLVSAA9 –AUGUST 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
(2)
PARAMETERS VALUE UNIT
RTN –0.3 to 100
Input voltage range
FLTTIM, RAMP, SENSE, OV, UV –0.3 to 15 V
Output voltage range FLT, PG
(3)
–0.3 to 100
Continuous output current FLT, PG 10 mA
Operating junction temperature range, T
J
–55 to 125 °C
ESD - Human body model (HBM) 2
kV
ESD - Charged device model (CDM) 1.5
(1) All voltages are with respect to SOURCE (unless otherwise noted).
(2) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) With 10 kΩ minimum series resistance. Range limited to –0.3V to 80V from low impedance source.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Input supply, SOURCE to RTN –80 –48 –12 V
Operating junction temperature range –40 85 °C
PRODUCT INFORMATIONS
(1)
T
A
PACKAGE PART NUMBER
−40°C to 85°C TSSOP-14 TPS2394PW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at wwww.ti.com.
THERMAL INFORMATION
TPS2394
THERMAL METRIC
(1)
UNITS
PW (14 (PINS)
q
JA
Junction-to-ambient thermal resistance 120.8
q
JB
Junction-to-board thermal resistance 62.8
°C/W
y
JT
Junction-to-top characterization parameter 1
y
JB
Junction-to-board characterization parameter 56.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2 Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPS2394