Datasheet

TPS2379
SLVSB98 –MARCH 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PRODUCT INFORMATION
(1)
DEVICE T
A
PACKAGE MARKING
DDA
TPS2379 –40°C to 85°C 2379
(SO-8 PowerPAD™)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over recommended T
J
range; voltages with respect to V
VSS
(unless otherwise noted)
VALUE UNIT
MIN MAX
V
DD
, DEN –0.3 100
RTN
(2)
–0.6 100
Input voltage CLS
(3)
–0.3 6.5 V
GATE
(3)
–0.3 18
[CDB, T2P] to RTN –0.3 100
RTN
(4)
Internally limited
Sinking current CDB, T2P 5 mA
DEN 1
Sourcing current CLS 65 mA
Human body model 2 kV
ESD Charged device model 500 V
System level (contact/air)
(5)
8 15 kV
T
JMAX
Internally limited °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) With I(RTN) = 0
(3) Do not apply voltages to these pins
(4) SOA limited to RTN = 80 V at 1.2 A.
(5) Discharges applied to circuit of Figure 1 between RJ-45, adapter, and output voltage rails per EN61000-4-2, 1999.
THERMAL INFORMATION
TPS2379
THERMAL METRIC
(1)
SO-8 PowerPad™ UNITS
8 PINS
θ
JA
Junction-to-ambient thermal resistance 45.9
θ
JCtop
Junction-to-case (top) thermal resistance 51.9
θ
JB
Junction-to-board thermal resistance 28.8
°C/W
ψ
JT
Junction-to-top characterization parameter 8.9
ψ
JB
Junction-to-board characterization parameter 28.7
θ
JCbot
Junction-to-case (bottom) thermal resistance 6.7
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(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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