Datasheet

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Bill of Materials and Schematics
Table 1. Bill of Materials (continued)
Count RefDes Value Description Size Part Number MFR
1 R14 61.9 k Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 R15 2.2 Ω Resistor, Chip, 1 W, 1% 2512 Std Std
1 R16 30.1 k Ω Resistor, Chip, 1/10 W, 1% 0805 Std Std
1 R17 20 Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 R18 10 Ω Resistor, Chip, 1/2 W, 1% 2010 Std Std
1 R19 2.2 Ω Resistor, Chip, 1/4 W, 1% 1210 Std Std
2 R20, R25 49.9 Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
R21, R30, 10 k Ω Resistor, Chip, 1/16 W, 1% 0603
3 Std Std
R31
1 R22 24.9 Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 R23 10.7 k Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 R24 4.64 k Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
3 R26, r29, R33 1 k Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 R27 0.33 Ω Resistor, Chip, 1 W, 1% 2512 Std Std
1 R28 4.99 k Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
2 R32, R34 41.2 k Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 R35 13.3 k Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
1 R9 25.5 k Ω Resistor, Chip, 1/16 W, 1% 0603 Std Std
2 T1, T2 ETH1-230LD XFMR, Mid-Power PoE Magnetics S0 14 Wide ETH1-230LD Coilcraft
1 T3 POE300F-50L Transformer, SMT for PoE/PD, xW, zzA 0810 × 1.181 inch POE300F-50L Coilcraft
1 T4 330 μ H Transformer, Driver, 330 μ H Ip, 1500V insolation 0.210 × 0.210 inch P0926 Pulse
TP1, TP5, 5012 Test Point, White, Thru Hole 0.125 × 0.125 inch
3 5012 Keystone
TP9
1 J5 Header 1x2 100 mils TH TH Std
2 TP2, TP11 5001 Test Point, Black, Thru Hole Color Keyed 0.100 × 0.100 inch 5001 Keystone
TP4, TP8, 5000 Test Point, Red, Thru Hole Color Keyed 0.100 × 0.100 inch
6 TP10, TP12, 5000 Keystone
TP13, TP15
1 U1 TPS2376DDA-H IC, IEEE 802.3af Power Device Controller S0-8 PowerPAD™ TPS2376DDA-H TI
1 U2 UCC3809D2 IC, Economy Primary-Side Controller, xx-V startup S08 UCC3809D-2 TI
1 U3 TCMT1107 IC< Photocoupler MF4 TCMT1107 Vishay
1 U4 TLV431ACDBVR IC, Shunt Regulator, 1.24-V ref, 6-V, 10-mA, 1% SOT23-5 TLV431ACDBVR TI
1 NA NA PCB, 2-Layer, 4.75" × 2.440" × 0.062" HPA244 Any
1 NA NA Shunt STC02SYAN Sullins
NA NA Rubber Bumper SPC
4 2563
Technology
Notes: 1 These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk (**) cannot be substituted. All other components can be substituted with equivalent MFG's components.
5. Bumpers, to be installed on bottom of PCB, at four corners, of four sides, and approximate center of board.
SLVU197B – March 2007 – Revised September 2007 TPS2376HEVM 11
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