Datasheet

TPS23751
TPS23752
www.ti.com SLVSB97C –JULY 2012–REVISED JANUARY 2014
THERMAL INFORMATION
TPS23751 TPS23752
THERMAL METRIC
(1)
UNITS
TSSOP-16 TSSOP-20
θ
JA
Junction-to-ambient thermal resistance 39.5 38.5
θ
JCtop
Junction-to-case (top) thermal resistance 25.9 23.8
θ
JB
Junction-to-board thermal resistance 21.1 25.6
°C/W
ψ
JT
Junction-to-top characterization parameter 0.7 0.7
ψ
JB
Junction-to-board characterization parameter 20.8 20.3
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.0 1.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
spacer, so notes in Thermal Table do not sit on top of the ROC title
RECOMMENDED OPERATING CONDITIONS
(1)
Voltages with respect to V
SS
(unless otherwise noted)
MIN NOM MAX UNIT
ARTN, RTN, V
DD
0 57
[LED, APD ,SRD, T2P, V
C
] to ARTN 0 18
Input voltage range V
[CTL,CS, MODE, SLPb, SRT, WAKE] to ARTN 0 V
B
SRT to ARTN 0.5 1.5
RTN 1.2 A
Sinking current SRD, T2P 2
mA
LED 10
Sourcing current V
B
(2)
5 mA
Continuous RTN current (T
J
≤ 125°C)
(3)
825 mA
R
CLS
(2)
60 Ω
Resistance
R
WAKE
392 kΩ
Capacitance V
B
(2)
0.08 µF
Junction temperature –40 125 °C
(1) ARTN tied to RTN
(2) Do not apply voltage supply to these pins.
(3) This is minimum current-limit value. Viable systems will be designed for maximum currents below this value with reasonable margin.
IEEE 802.3at permits 600mA continuous loading.
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