Datasheet

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RECOMMENDED OPERATING CONDITIONS
(1) (2)
DISSIPATION RATINGS TABLE
TPS23750
TPS23770
SLVS590B – JULY 2005 – REVISED FEBRUARY 2008
All voltage values are with respect to V
SS
unless otherwise noted.
MIN NOM MAX UNIT
V
DD
Input voltage range
(3)
COM, SEN, SENP 0 67 V
FB, COMP, MODE, BL 0 V
BIAS
Input voltage range AUX to COM 0 16 V
RSP to RSN 0 1
AUX 0 2
Sourcing current V
BIAS
0 2 mA
COMP 0 2
Q
G
GATE loading 20 nC
AUX load capacitance 0.8 25 µ F
V
BIAS
load capacitance 0.08 1.5 µ F
R
FREQ
30 300 k Ω
T
J
Operating junction temperature range -40 125 ° C
T
A
Operating ambient temperature range -40 85 ° C
(1) RSN, COM, and RTN should be tied together. SENP should be tied to V
DD
except for the buck configuration, where it should be tied to
the output positive rail.
(2) TMR, FREQ, CLASS, DET, V
BIAS
, and GATE should not be externally driven.
(3) Junction temperature may be a constraining factor for high bias power designs.
θ
JP
θ
JC
θ
JA
θ
JA
θ
JA
MAXIMUM POWER RATING
PACKAGE
° C/W
(1)
° C/W ° C/W
(2)
° C/W
(3)
° C/W
(4)
(W)
(5)
PWP (TSSOP-20) 1.4 26.62 32.6 151.9 73.8 1.2
(1) Thermal resistance junction to pad.
(2) See TI document SLMA002 for recommended layout. This is a best case, zero airflow number.
(3) JEDEC method with low-k board (2 signal layers) and power pad not soldered (worst case).
(4) JEDEC method with high-k board (4 layers, 2 signal and 2 planes) and power pad not soldered.
(5) Based on TI recommended layout and 85 ° C ambient.
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