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(a) (b)
SENSE
RESISTOR
R
SET
TPS2359
SENP
R
SET
SENM
SET
TPS2359
SENP
SENM
SET
TPS2359
www.ti.com SLUS792H –FEBRUARY 2008–REVISED MAY 2013
Layout Consideration
TPS2359 applications require careful attention to layout in order to ensure proper performance and minimize
susceptibility to transients and noise. Important points to consider include:
1. Connect AGND, GNDA, and GNDB to a ground plane.
2. Place 0.01-μF or larger ceramic bypass capacitors on IN12A, IN12B, VDD3A, and VDD3B. Minimize the loop
area created by the leads running to these devices.
3. Minimize the loop area between the SENMx and SENPx leads by running them side-by-side. Use Kelvin
connections at the points of contact with R
SENSE
(Figure 33).
4. Minimize the loop area between the SETx and SENPx leads. Connect the SETx leads to the same Kelvin
points as the SENPx leads, or as close to these points as possible.
5. Size the following runs to carry at least 20 Amps:
– Runs on both sides of R
SENSE
– Runs from the drains and sources of the external FETs
6. Minimize the loop area between the OUT12x and SENPx leads.
7. Size the runs to IN3x and OUT3x to carry at least 1 Amp.
8. Soldering the powerpad of the TPS2359 to the board will improve thermal performance.
Figure 33. SENMx and SENPx Runs Side-by-Side to Maximize Common Mode Rejection
NOTE
Additional details omitted for clarity.
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