Datasheet

Layouts of the EVM and the Interface Card
1-5
Introduction
Table 1–2.Components on the Interface Card (SLVP155)
Reference Qty. Part Number Description MFR.
C1, C2 2 TPSD157M016R150 Capacitor, tantalum, 150 µF, 16 V,
150 µW, 20%
AVX
C3 1 10TPB220M Capacitor, POSCAP, 220 µF, 10 V,
40 µW, 20%
Sanyo
C4, C5, C6 3 GRM235Y5V106Z016A Capacitor, ceramic, 10 µF, 16 V, 80%–20%,
Y5V
TDK
C7, C8, C9 3 ECJ-2VF1C105Z Capacitor, ceramic, 1 µF, 16 V, 80%–20%,
Y5V
Panasonic
J1–J9 6 3267 Connector, banana jack, uninsulated Pomona
P1 1 50-22SN-11 Connector, 44-pin edge w/mtg tabs (for 0.062”
PCB)
Cinch
R1, R2 2 ERJ–8GEYJ103V Resistor, chip 10 kΩ, 1.8 W, 5% Panasonic
S1 1 EG1218 Switch, 1P2T, slide, PC-mount, 200-mA E-Switch
TP1–TP3 3 240-345 Test point, red, 1 mm Farnell
TP4–TP6 3 240-333 Test point, black, 1 mm Farnell
1.3 Layouts of the EVM and the Interface Card
Figures 1–3 and 1–4 illustrate the placements of the components and the top-
layer layouts for the hot-swap EVM board and the interface card, respectively.
All components are placed on the top layers only. The bottom layers are
ground planes except for a few short traces on the hot-swap EVM.
Figure 1–3. Top Layer of the Hot-Swap EVM, and Placement of Components
Top Layer
Top Assembly